Dr. Rahul Panat
ME 520 Seminar
Tuesday, April 14
Successful implementation of the microelectronic devices and systems for various applications requires that its components, having heterogeneous material sets, be ‘integrated’ over a platform, i.e., be able to undergo a simultaneous mechanical deformation without failure. Examples of such an integration include the ultra-high performance (UHP) microprocessor packages, where integration of ceramic capacitors very close to the microprocessor core is necessary to get the prescribed processor performance. Starting with the microprocessor package structure and design fundamentals, I will discuss a particular problem of crack formation in the UHP microprocessors at Intel along with issues such as solder bridging, and interconnect cracks. HVM compatible (i.e. scalable) solution paths will be described which solved the interface fracture issues, enabling the realization of the UHP microprocessors in the marketplace.
A challenging problem of the integration of electronic components on flexible platforms will also be discussed. We have developed a metal-elastomer system with engineered interfaces to obtain ultra-stretchable interconnects that can undergo a linear strain of >100% without failure. Such stretch-ability is obtained without any geometrical manipulations such as serpentines or out-of-plane wrinkles. It is shown that the resistivity remains within about 15% during the deformation, indicating an ideal use of this system for wearable applications. Possible mechanisms such as recrystallization and the suppression of necking instability in achieving the high stretch-ability are discussed. In addition, a successful development of stretchable Li-ion battery using origami principles is presented. Lastly, some recent advances in printed electronics and large-strain sensors at the Advanced Manufacturing Laboratory at WSU are discussed.
Bio: Dr. Rahul Panat received his MS in Mechanical Engineering from the University of Massachusetts, Amherst, and his PhD from the University of Illinois at Urbana-Champaign in Theoretical and Applied Mechanics. He worked at Intel’s manufacturing R&D from 2004-2014 before joining WSU in Fall 2014. At Intel, Dr. Panat worked on lead-free conversion of flash memory processors, fine line–space PCB development, and ceramic capacitors and their integration in IC chips. He was the lead process R&D engineer for industry’s first halogen free IC chip. Dr. Panat also worked as an adjunct faculty at the Arizona State University from 2012-2014 in the area of flexible Li-ion batteries. Dr. Panat is building the Advanced Manufacturing Laboratory at WSU with concentration in the areas of flexible electronics, 3-D mm wave antennas, Li-ion batteries, and printed electronics. Dr. Panat is the recipient of several awards including a Gold Medal from MRS, and several Divisional Recognition Awards at Intel, including one for his work on the halogen-free chip.