Dr. Rahul Panat
ME 520 Seminar
Tuesday, April 14
12:30 p.m.
MEB 238
Successful
implementation of the microelectronic devices and systems for various
applications requires that its components, having heterogeneous material sets,
be ‘integrated’ over a platform, i.e., be able to undergo a simultaneous
mechanical deformation without failure. Examples of such an integration include
the ultra-high performance (UHP) microprocessor packages, where integration of
ceramic capacitors very close to the microprocessor core is necessary to get
the prescribed processor performance. Starting with the microprocessor package
structure and design fundamentals, I will discuss a particular problem of crack
formation in the UHP microprocessors at Intel along with issues such as solder
bridging, and interconnect cracks. HVM compatible (i.e. scalable) solution
paths will be described which solved the interface fracture issues, enabling
the realization of the UHP microprocessors in the marketplace.
A
challenging problem of the integration of electronic components on flexible
platforms will also be discussed. We have developed a metal-elastomer system
with engineered interfaces to obtain ultra-stretchable interconnects that can
undergo a linear strain of >100%
without failure. Such stretch-ability is obtained without any geometrical
manipulations such as serpentines or out-of-plane wrinkles. It is shown that
the resistivity remains within about 15% during the deformation, indicating an
ideal use of this system for wearable applications. Possible mechanisms such as
recrystallization and the suppression of necking instability in achieving the
high stretch-ability are discussed. In addition, a successful development of
stretchable Li-ion battery using origami principles is presented. Lastly, some
recent advances in printed electronics and large-strain sensors at the Advanced
Manufacturing Laboratory at WSU are discussed.
Bio: Dr. Rahul Panat received his MS in
Mechanical Engineering from the University of Massachusetts, Amherst, and his PhD
from the University of Illinois at Urbana-Champaign in Theoretical and Applied
Mechanics. He worked at Intel’s manufacturing R&D from 2004-2014 before
joining WSU in Fall 2014. At Intel, Dr. Panat worked on lead-free conversion of
flash memory processors, fine line–space PCB development, and ceramic
capacitors and their integration in IC chips. He was the lead process R&D
engineer for industry’s first halogen free IC chip. Dr. Panat also worked as an
adjunct faculty at the Arizona State University from 2012-2014 in the area of
flexible Li-ion batteries. Dr. Panat is building the Advanced Manufacturing
Laboratory at WSU with concentration in the areas of flexible electronics, 3-D
mm wave antennas, Li-ion batteries, and printed electronics. Dr. Panat is the
recipient of several awards including a Gold Medal from MRS, and several Divisional
Recognition Awards at Intel, including one for his work on the halogen-free
chip.
